TTL TEKNOPRO MC01Q87i7SSD

TEKNOPRO

Funcionalidad profesional de sobremesa

Características Técnicas:

Procesador4th Generation Intel® Core™ i7-4790 Processor (8 Mb Smart Cache, 3.60 GHz) LGA1150 socket
ChipsetIntel® Q87 Chipset, consisting on the Intel® Q87 Platform Controller Hub (PCH)
Motherboard ManufacturerPegatron
Motherboard model name and reference number  TTL Q87-M1 by Pegatron
Number and type of thecontrollers  Six Serial ATA (SATA) 6 Gb/s ports.
Intel® Rapid Storage Technology / SATA RAID
Infineon® TPM IC on board
 
Number and type of PCI slotsExpansion capabilities
• One PCI Express x16 3.0/2.x/1.x add-in card connector
• One PCI Express x1 2.x/1.x add-in card connector
• Two Conventional PCI bus add-in card connectors
 
Memory– Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
– Support for DDR3 1333 MHz to DDR3 1600 MHz DIMMs
– Support for 1 Gb, 2 Gb, 4 Gb and 8 Gb memory technology
– Support for up to 32 GB of system memory with four DIMMs using 8Gb memory technology
– Support for non-ECC memory
– Support for 1.5 V (standard voltage) and 1.35 V (low voltage)
 
Ports I/OUSB Ports
– USB 3.0 Configuration (2 x Back + 2 x Internal)
– USB 2.0 Configuration (4 x Back + 2 x Front + 4 x Internal)
AUDIO:
– Audio 5.1-channel Intel (R) High Definition Audio (3 x Back + 2 x Front)
Remark: The desktop board includes two serial port header and one parallel port header.
BIOS – American Megatrends (AMI) BIOS 128 Mb
– Support for Advanced Configuration and Power Interface
(ACPI), Plug and Play, SMBIOS, UEFI
– Flash (for BIOS update), ACPI compliant
– Bootable from USB device
– PXE (PrebooteXecution Environment) booting capability
Main Memory This configuration includes 2 x 4GB DDR3 1600MHz
– Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets (Two free slots)
The board has four DIMM sockets and supports the following memory features:
• 1.5 V DDR3 SDRAM DIMMs with gold plated contacts, with the option to raise the voltage to support higher performance DDR3 SDRAM DIMMs.
• 1.35 V Low Voltage DDR3 DIMMs (JEDEC specification)
• Two independent memory channels with interleaved mode support
• Unbuffered, single-sided or double-sided DIMMs with the following restriction: DIMMs with x16 organization are not supported.
• 32 GB maximum total system memory (with 8 Gb memory technology).
• Minimum recommended total system memory: 1 GB
• Non-ECC DIMMs
• Serial Presence Detect
• DDR3 1600 MHz, DDR3 1333 MHz, and DDR3 1066 MHz SDRAM DIMMs
Graphics Integrated Intel® High Definition (Intel® HD) Graphics 4600
– VGA port
– DVI-D port
– HDMI port
– DP port
The Intel HD graphics controller features the following:
• 3D Features :
– DirectX* 11.1 support
– OpenGL* 4.0 support
• Video :
– Next Generation Intel® Clear Video Technology
– Supports triple independent display
– Support for a PCI Express 3.0 x16 add-in graphics card
NetworkGigabit (10/100/1000 Mb/s) LAN subsystem using the Intel® I217LM Gigabit Ethernet Controller
The LAN subsystem consists of the following :
– Intel I217LM Gigabit Ethernet Controller (10/100/1000 Mb/s)
– Intel Q87 Express Chipset
– RJ-45 LAN connector with integrated status LEDs
Additional features of the LAN subsystem include:
– CSMA/CD protocol engine
– LAN connect interface between the PCH and the LAN controller
– Conventional PCI bus power management
• ACPI technology support
• LAN wake capabilities
– ACPI technology support
– LAN wake capabilities
– LAN subsystem software
The Intel I217LM Gigabit Ethernet Controller supports the following features:
Network Features:
• Compliant with the 1 Gb/s Ethernet 802.3, 802.3u, 802.3z, 802.3ab specifications
• Multi-speed operation: 10/100/1000 Mb/s
• Full-duplex operation at 10/100/1000 Mb/s; Half-duplex operation at 10/100 Mb/s
• Flow control support compliant with the 802.3X specification as well as the specific operation of asymmetrical flow control defined by 802.3z
• VLAN support compliant with the 802.3q specification
• MAC address filters: perfect match unicast filters, multicast hash filtering, broadcast filter, and promiscuous mode
Performance Features:
• Configurable receive and transmit data FIFO, programmable in 1 KB increments
• TCP segmentation capability compatible with Windows NT 5.x off-loading features • Fragmented UDP checksum offload for packet reassembly
• IPv4 and IPv6 checksum offload support (receive, transmit, and TCP segmentation offload)
• Split header support to eliminate payload copy from user space to host space
• Receive Side Scaling (RSS) with two hardware receive queues
• Supports 9018 bytes of jumbo packets
• Packet buffer size
• LinkSec offload compliant with 802.3ae specification
• TimeSync offload compliant with 802.1as specification
Power Management Features:
• Magic Packet* wake-up enable with unique MAC address
• ACPI register set and power down functionality supporting D0 and D3 states
• Full wake up support (APM, ACPI)
• MAC power down at Sx, DMoff with and without WoL
• Auto connect battery saver at S0 no link and Sx no link
• Energy Efficient Ethernet (EEE) support
• Latency Tolerance Reporting (LTR)
• Optimized Buffer Flash/Fill (OBFF) support
• ARP and ND proxy support through LAN Connected Device proxy
• Wake on LAN (WoL) from Deep Sx
• Provides lower power usage
Hard disk driveOne disk, 2.5”, 320 GB, 7200RPM, SATA-3 6 Gb/s
Optical Drive DVD +/-RW SATA x24
AudioAudio 5.1-channel Intel (R) High Definition Audio via the Realtek ALC662VD
Case– Tower format
– With openings at the rear for all PCI and PCI Express connectors.
– Two frontal USB 2.0
– Two internal 3.5” device bays (one occupied by the hard disk) and adapters to feet 2.5” disks.
– Tooless
– The case can be lockable.
– Dimension (DxWxH): 37,5 cm x 19,8 cm x 37,0 cm
Power Supply and ventilation Power Supply:
– 100 – 240V
– 50Hz-60Hz
– 80 PLUS qualified
– Active PFC
– 350W
– Power cord with Swiss plug (1.8m long).
– TTL Computers manufactured by TTL.  Our computers are built using Intel components such as motherboards, microprocessors and chassis); and non-Intel components like memory, HDD, Optical Drive or power supply. All of them tested and certified for a machine loaded to its maximum capacity in terms of memory, device bays  and expansion cards.
Ventilation:
– Chassis design for high and optimized ventilation
– Microprocessor with active heatsink
Noise30 Db(A) (measured at 40cm from the rear of the PC unit).